一、产品介绍唯特偶锡条产品采用高纯度原锡为原材料，以国际先进的制造方法并在严密的制程管制下精制而成，完全符合IPC及国家标准要求，各种金属合金成分均可生产。二、产品特点·加入足量的抗氧化元素，抗氧化能力强、锡渣少。·金属杂质少和氧化物含量低，对锡缸腐蚀性小；·熔融后锡液面光滑、平整，粘度低、有极佳的流动性。三、主推产品无铅合金成分合金组分合金成分（重量%）SnAgCuSbBiZnInAuNiAsPbAlCdFeSn≥99.90≤0.10≤0.05≤0.10≤0.10≤0.001≤0.10≤0.05≤0.01≤0.03≤0.10≤0.001≤0.002≤0.02Sn97.0Ag3.0余量3.0±0.2≤0.10≤0.10≤0.10≤0.001≤0.10≤0.05≤0.01≤0.03≤0.10≤0.001≤0.002≤0.02Sn96.5Ag3.0Cu0.5余量3.0±0.20.5±0.1≤0.10≤0.10≤0.001≤0.10≤0.05≤0.01≤0.03≤0.10≤0.001≤0.002≤0.02Sn99.7Ag0.3余量0.3±0.1≤0.10≤0.10≤0.10≤0.001≤0.10≤0.05≤0.01≤0.03≤0.10≤0.001≤0.002≤0.02Sn99.0Ag0.3Cu0.7余量0.3±0.10.7±0.1≤0.10≤0.10≤0.001≤0.10≤0.05≤0.01≤0.03≤0.10≤0.001≤0.002≤0.02Sn99.8Cu0.2余量≤0.100.2±0.1≤0.10≤0.10≤0.001≤0.10≤0.05≤0.01≤0.03≤0.10≤0.001≤0.002≤0.02Sn99.5Cu0.5余量≤0.100.5±0.1≤0.10≤0.10≤0.001≤0.10≤0.05≤0.01≤0.03≤0.10≤0.001≤0.002≤0.02Sn99.3Cu0.7余量≤0.100.7±0.1≤0.10≤0.10≤0.001≤0.10≤0.05≤0.01≤0.03≤0.10≤0.001≤0.002≤0.02有铅合金成分合金组分合金成分（重量%）SnPbCuSbBiZnAsAlCdFeS除Sb、Bi、Cu以外，杂质总和Sn63/Pb3761.5-64.0余量≤0.05≤0.30≤0.08≤0.002≤0.03≤0.005≤0.005≤0.02≤0.02≤0.08Sn60/Pb4058.5-61.0余量≤0.05≤0.30≤0.08≤0.002≤0.03≤0.005≤0.005≤0.02≤0.02≤0.08无铅锡条简介合金组分型号比重（g/cm3）熔点（℃）波峰焊推荐焊接温度（℃）用途及特点SnGW-1007.3232260-280调整无铅焊料合金比例，喷纯锡板专用Sn97.0Ag3.0GW-3007.41221-230260-280焊接性好、润湿性强、成本高，调整SnAg3.0Cu0.5合金焊料比例专用Sn96.5Ag3.0Cu0.5GW-3057.4217260-280主流无铅焊料、焊接性能好、润湿性强、成本高Sn99.7Ag0.3GW-03007.33217-227260-280焊接性一般、润湿性一般、调整SnAg0.3Cu0.7合金焊料比例专用Sn99.0Ag0.3Cu0.7GW-03077.3217-227260-280主流无铅焊料、焊接性能一般、润湿性一般Sn99.8Cu0.2GW-0027.31227260-280性价比高，但使用温度略高Sn99.5Cu0.5GW-0057.31227-235260-280性价比高，但使用温度略高Sn99.3Cu0.7GW-0077.31227260-280主流无铅焊料。性价比高，但使用温度略高有铅锡条简介合金组分型号比重（g/cm3）熔点（℃）波峰焊推荐焊接温度（℃）用途及特点Sn63/Pb37GW-63/378.4183230±10主流有铅焊料、焊接性能好、润湿性强，适用于焊接精密电器、电子工业、印刷线路等Sn60/Pb40GW-60/408.5183-190230±10主流有铅焊料、焊接性能好、润湿性强、成本稍低，适用于焊接普通电器、电子工业等可按客户要求研制各种合金成分、配比的锡条。